Utica, NY – Danfoss Silicon Power today welcomed the first employees to its Utica, New York facility — marking progress toward full operation of its silicon-carbide (SiC) power module production.
In March 2017, the company announced that it would establish production of SiC power modules in Utica.
Danfoss Power Electronics packaging facility at QUAD-C will advance New York’s leadership in next-generation semiconductor research, development, and commercial fabrication to meet the global demand for smaller, faster, and more efficient devices. This will expand the scope of the Nano Utica initiative from computer chip commercialization into power electronics applications for industrial products such as wind turbines, utility-scale solar inverters, data centers and electric cars. GE’s advancements in silicon carbide (SiC) technology play an important enabling role.
The company recently took over the Quad-C facility at the State University of New York (SUNY)’s Utica campus as part of a transatlantic collaboration with General Electric through New York Power Electronics Manufacturing Consortium (NY-PEMC). The private-public consortium and other similar programs were established in 2014 by the state of New York with a total investment of more than $20 billion USD for the creation of high-tech jobs.